ViiRA Semi Ops is the agentic intelligence layer that plugs into any semiconductor manufacturing environment — ingesting every signal, reasoning over every process and acting like a team of engineers who never sleep.
Agentic Workflow
Embedded Intelligence
A Semiconductor device takes 90–120 days from raw material to packaged module. It crosses three discrete manufacturing domains. It depends on hundreds of sensors, tight recipe windows, and highly experienced process engineers whose knowledge does not really transfer when they leave.
India's new fabs and OSATs are being built right now — largely without 40 years of embedded process learning. The existing software solutions were built for IDMs with 1000+ person engineering organisations and large software budgets. They are not agentic, not modular, and not designed for the capital-constrained, talent-scarce reality of emerging semiconductor markets.
ViiRA Semi Ops is delivered through two complementary entities that work together from day one — and hand over progressively as the agent matures.
The agentic AI platform. Plugs into your fab's existing equipment, ingests every sensor stream and process signal, maintains a live digital twin of your manufacturing environment, and acts — alerting, recommending, adjusting recipes, and documenting — continuously, across all three phases of the semiconductor value chain.
Runs entirely within your air-gapped edge appliance. Zero external data exposure. Gets smarter with every wafer.
The managed services arm. A team of semiconductor process engineers who deploy alongside ViiRA Semi at your site, run the floor using proven methods, and train the agent by doing their work in its presence. Every process decision, every yield call, every anomaly response becomes a labeled training event.
The human-AI handoff is not a cutover date — it is a gradual, verifiable transfer of operational confidence governed by a maturity scorecard both parties can inspect at any time.
Each phase is a deployable module that activates as your operation scales.
The most unforgiving domain in Semiconductor manufacturing. A single thermal drift or contamination event can destroy a boule worth $20,000+. CrystalMind monitors furnaces in real time, maintains a live digital twin of every growth run, and flags defect signatures before they propagate.
From wafer to die, FabEdge sits as a process control intelligence layer across the entire device fabrication sequence — epitaxy, gate oxidation, ion implantation, lithography, metallisation, and passivation — and orchestrates the handoff into OSAT operations.
The finished die into a power module — DBC substrate, solder or sinter attach, wire or ribbon bonding, encapsulation, housing. ModuleOS orchestrates the full ATMP flow with digital birth records, automated qualification documentation and supply chain intelligence.
ViiRA Semi's Integration Bus speaks SEMI-standard equipment communication protocols that are vendor and material neutral. The AI Agent Core operates on a process recipe ontology that is configured per customer, per material at deployment.
Whether you are building a greenfield fab, scaling an OSAT operation, or advising on India's semiconductor future — let's talk about what ViiRA Semi Ops can do for your operation.